Featured Experimental Platform #4 Advanced Material Preparation and Characterization
Release date: 2025-05-16
Visits: 34
Source: 山东高等技术研究院
Advanced Material Preparation and Characterization
The advanced material preparation and characterization platform serves as a comprehensive experimental facility equipped with state-of-the-art material synthesis and performance evaluation instruments. At present, high-performance liquid chromatography, gas chromatography, differential scanning calorimetry, thermomechanical analysis, dynamic thermomechanical analysis, and specific surface area and pore size analysis equipment are configured. They are primarily employed for structural characterization and thermal property measurement of diverse material systems (e.g. ceramics, metals, inorganic non-metals, polymers) under various environmental conditions (e.g. temperature, humidity, stress) including characterizing thermal stability, heat capacity, and thermal transport properties of materials, measuring thermal expansion/contraction, softening temperature and viscoelastic properties of materials, and determination of specific surface area and pore size distribution for precise microstructural characterization of materials.
Based on this platform, a research system for thermal functional materials has been established, and the relevant processes in the design, synthesis, and preparation of thermal functional materials have been improved. A basic research framework including physical property characterization, structural analysis, and performance optimization has been formed, providing strong support for the development of new thermal functional materials. Thermal functional materials such as paraffin@SiO2 microcapsules, liquid metal@SiO2 microcapsules, graphene paper, and high-performance thermal conductive silicone grease have been successfully prepared. The thermal conductive silicone grease developed on the platform has excellent performance, with a thermal conductivity of up to 11 W/(m·K), which is significantly higher than that of general commercial silicone grease. This can significantly improve the heat dissipation efficiency of electronic devices.
Based on this platform, a research system for thermal functional materials has been established, and the relevant processes in the design, synthesis, and preparation of thermal functional materials have been improved. A basic research framework including physical property characterization, structural analysis, and performance optimization has been formed, providing strong support for the development of new thermal functional materials. Thermal functional materials such as paraffin@SiO2 microcapsules, liquid metal@SiO2 microcapsules, graphene paper, and high-performance thermal conductive silicone grease have been successfully prepared. The thermal conductive silicone grease developed on the platform has excellent performance, with a thermal conductivity of up to 11 W/(m·K), which is significantly higher than that of general commercial silicone grease. This can significantly improve the heat dissipation efficiency of electronic devices.
